The direction of research
Item |
Capability forthis year |
2009 |
2010 |
|
Max. Layers |
18 |
24 |
30 |
|
Track width/space |
Internal (mil) |
4/4 |
3/3 |
3/3 |
External (mil) |
4/4 |
4/4 |
4/3 |
|
Board Thickness/Hole Dimension |
10:1 |
12:1 |
15:1 |
|
Copper Thickness(oz) |
5 |
6 |
8 |
|
Impedance Control |
¡À10% |
¡À8% |
¡À5% |
|
Materials |
High frequent/ Microwave material |
SV |
SV |
SV |
¡¡ |
Free halogen FR4 |
SV |
SV |
SV |
¡¡ |
Lead Free Materials |
SV |
SV |
SV |
¡¡ |
Mix lamination |
/ |
P |
SV |
¡¡ |
Metal Based/Core |
P |
SV |
SV |
¡¡ |
HighTg |
SV |
SV |
SV |
HDI |
1+N+1 |
/ |
P |
P |
Buries the type resistance/electric capacity |
/ |
/ |
P |
|
P:Prototype; SV:Small Volume |
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