Technical Capability
| Item | Parameter | Specification | |||||
| Max.layer | 30 layers | ||||||
| Material Type | FR-4,Aluminum Based,Copper based,High frequency plate,Heavy copper,BT,Rogers,PTFE ect | ||||||
| Material Thickness | Type |
Min.Thickness©L | Max.Thickness©L | ||||
| Single/double sided printed board | 0.2mm | 8.0mm | |||||
| Multilayer printed board | 4L:0.4;6L:0.8; | 8.0mm | |||||
| 8L:1.0;10L: | |||||||
| 1.2;12L:1.5 | |||||||
| Min.Hole Dimenision | Board Thickness<2.0©L | 0.2mm | Finished Hole Dimension | ||||
| Board Thickness¡Ý2.0©L | Aspect ratio¡Ü10 | Finished Hole Dimension | |||||
| Max.Panel Dimension | Single/double sided printed board | 600mm*1000mm | |||||
| Multilayer printed board | 600mm*1000mm | ||||||
| Plating thickness thickness |
Technique | Plating thickness | Min.thickness | Max.thickness | |||
| P.T.H(Micron) | PTH wall thickness | 20 | 25 | ¡¡ | |||
| Panel hard-gold plating(microinch) | Nickle thickness | 100 | 300 | ||||
| Gold Thickness | 1 | 12 | ¡¡ | ||||
| Immersion Gold(microinch) | Nickle thickness | 100 | 150 | ||||
| Gold Thickness | 1 | 3 | |||||
| Bottom Copper Thickness | Internal/External Copper Thickness(oz) | 0.5 | 5 | ||||
| Finished Copper Thickness | External(oz) | 1 | 6 | ||||
| Internal(oz) | 0.5 | 6 | |||||
| Insulated Thickness(©L) | 0.06 | ---- | ¡¡ | ||||
| Min.Track Width(mil) | 3/5mil | Allowed some area has the 3 mil line | |||||
| Min.Track Space(mil) | 3/5mil | Allowed some area has the 3 mil line | |||||
| Min SolderMask Ring(mil) | PTH:3mil | ||||||
| >Tooling Hole:6mil | |||||||
| Space Between Track to Edge(©L) | CNC:0.25mm;V-CUT:0.4mm | ||||||
| Track Width/Space(Mil) | Max.copper Thickness(oz) | The line width can not be lower than in the guarantee spacing's situation wants the evaluation | |||||
| 4/4;4/5/td> | 0.5 | ||||||
| 4/6;5/5;6/5 | 1 | ||||||
| 7/7 | 2 | ||||||
| 9/9 | 3 | ||||||
| 11/11 | 5 | ||||||
| Solder Mask | Solder Mask Opening(mil) | 2/4 | 1. refers to unilateral; 2. to guarantee that the green oil bridge oravoids the dewline permitting 2mil(finished copper plate thick1oz) | ||||
| Solder Mask Bridge(mil) | 6 | Refers to between the IC base pin | |||||
| Color | Green,White,Yellow,Purple,Red,Blu,Black etc. | ||||||
| legend | Min.Track Width,High(mil) | 5/8 | The board is too small or the character is too dense time permits 5mil | ||||
| Color | White,Yellow,Black | ||||||
| Surface Treatment Technology | HASL/HAL£¬HASL,OSP,Immersion Tin,Immersion,Gold ,etc. | ||||||
| Board Thickness Tolerance£¨©L£© | L¡Ü100mm:¡À0.1mm;100¡ÜL¡Ü200:¡À0.15©L;200¡ÜL¡Ü300:¡À0.2©L;L¡Ý300:¡À0.2©L | ||||||
| Digital Control V-CUT | Size630mm*630mm,Thickness0.20mm | ||||||
| Characteristic Impedance Control tolerance% | 10% | ||||||
| Finished Board Thickness Tolerance(©L) | Thickness Between0.2-0.5mm:¡À0.05mm,Thickness less than0.8mm:¡À10%,Thickness more than0.8mm:¡À8%. | ||||||